Xceed – New Generation 3D AOI

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Xceed – New Generation 3D AOI

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High Accuracy & High Speed

3D AOI Sensor Head (TRSC-I)

3D AOI Sensor Head

 

  • High Speed CMOS Camera (4Mega-pixel) with Dual Laser Technology
  • RGB LED Lights
  • Telecentric Lens
  • Light Weight, Compact Sensor Head Design
  • Industry Leading Inspection Speed: 65 cm2/sec @ 14 x 14um
  • Cycle Time: For PCB 260mm x 200mm = 10 seconds including load and unload

 

3D AOI Sensor Head (TRSC-I)

3D AOI

  • True 3D measurement provides the most accurate and repeatable inspection results with the minimum false calls.
3D AOI Xceed

Smart Inspection

  • Dark PCB
  • White PCB
 
  • Ceramic PCB
  • Reflective Components
 

Real 3D Image

  • Advanced Signal Processing results in noise-less, clear and accurate 3D images.
Real 3D Image

Easy Software

Common, Simple User Interface

  • PARMI’s exclusive, uniform and common user interface for both the SPI and AOI systems make it easy to learn and use for both new and existing SPI customers.
 

Programming Ease

  • One-Click teaching provides automatic ROI creation for most common inspection settings.
  • Includes 7 fundamental inspection items: Missing, Lift, Size, Misalignment, Side-mount, Tombstone, Upside-down.
 

Barcode & Bad Mark Recognition

  • In one inspection, both Barcode and Bad Mark are recognized simultaneously. 1D, 2D, QR Laser Marking, and Printing barcodes are recognizable.
 

Detect All Defect Types

Detect all defect types in smt

公司簡介

帝仕高國際有限公司(Dynamite International Corp.)簡稱DIC,成立於西元1994年,以經營電子產業設備之銷售,技術服務與製程支援為基礎,進而提供客戶專業專精之生產設備及完整的產線規劃之公司。...

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